Vishay

SOT-23 generic package

Invensense

MPU-6000 accelerometer/gyroscope package

NXP

SOD323F plastic, surface-mounted package; 2 leads; 1.7 mm x 1.25 mm x 0.7 mm body

Bourns

CRA2512 resistor package

Linear Technology

S5 Package 5-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1635)

TDK (EPCOS)

QCS5P package (SAW RF filters)

Maxim Integrated

6-pin SOT-23 package from Maxim.

Diodes Incorporated

5-Pin SOT25 package from Diodes Inc.

Ohmite

The C40 Series Heat Sink System (Patent Pending)offers flexible, high performance and compact heatsinks with an exchangeable cam clip system for TO-247, TO-264 and SOT-227 (clip in development)devices. This powerful heat sink can be thru-holesoldered in single or paired configurations. The paired unit has mounting holes to accomodate a 40mm x 40mm fan. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection.

Linear Technology

MS8E Package8-Lead Plastic MSOP, Exposed Die Pad(Reference LTC DWG # 05-08-1662 Rev K)