3M Electronic Solutions Division

24 way Dual In Line (DIP) Zero Insertion Force (ZIF) Sockets, 100 mil (2.54mm) Pin Pitch, 300 mil (7.62 mm) Row Pitch

MULTICOMP PRO

RF / Coaxial Connector, SMA Coaxial, Straight Flanged Jack, 50 ohm, Beryllium Copper

Wakefield-Vette

Heat Sink BGA Aluminum Alloy Top Mount

Kyocera AVX

HIGH FREQUENCY/RF RESISTORS 50 Ohm DC-6 GHz

UIY

UIY Drop-in Circulator, 12.7x12.7x8

Spectrum Control

EMI Feedthrough Filters .75UF 50V 15A

Vishay Siliconix

3D model for PowerPAK 1212-8SLW package

TTM Technologies, Inc.

The 1M803 Micro Xinger® is a low-profile, miniature 3dB hybrid coupler in an easy-to-use surface mount package designed for U-NII, ISM, and hyper LAN applications. The 1M803 is designed for balanced amplifiers and signal distribution and is an ideal solution for the ever-increasing demands of the wireless industry for smaller printed circuit boards and high performance.

Tusonix a Subsidiary of CTS Electronic Components

10nF feed through capacitor, #12-28 Thread Size,

Isolated Module DC DC Converter 1 Output 5V - - - 3A 18V - 36V Input