TEXAS INSTRUMENTS

TPS65987D USBC Power Delivery IC, Body Size 7.0 x 7.0mm, High 1.0mm, Pitch 0.4mm.

DFN 14 Package, Body Size 4.0 x 3.0mm, Pitch 0.5mm, High 0.8mm.

Lite on

Optocoupler LTV-847, Body Size 19.84 x 6.5mm, High 4.6mm, Pitch 2.54mm.

Alpha & Omega Semiconductor

DFN3X3B_10L_EP1 Package, Body Size 3.0 x 3.0mm, High 1.0mm, Pitch 0.5mm.

Texas Instruments

Link to package drawing at TI:https://www.ti.com/lit/ml/mpcs002d/mpcs002d.pdf?ts=1723978430782&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FTPS62933%253Fbm-verify%253DAAQAAAAJ_____3sin2fD_LM_5cSpKzif8FEcuEKdZ3KGDkjpTJE6uWBBUN2T9o6xQ6xBgotowqcoOhCJhEPi1vx8awyUvsclprg9k1gQ0uH_x4bVTQAhiKo5S4PqjsXVgjLx_eTuWmE_6y7rNZ_NSLiIyc18GnznuGW7M85jC3zMavw3h5EJwoWWpRXFNLv65ZyOm_h1pKf-u9YK1jjCoglSi7JBq1VkSjL6oFBtodn1hx2J4B8pkREpsaUKuh1HwYdXk4nxQl0sydS6CBHFMsim9SlwrJRz9guQCyv_GdE167v99uTKk2DSfLJBGeNaCy2li5mzEEu10CrUD6l3zK08YEdopw

TDK

B82477G4 Power Inductor, Body Size 12.8 x 12.8mm, High 8mm.

Vishay

Optorelay

BGA144 7x7mm, 0.5mm Pitch

RP2354B

Package QFN-80 for RP2354B. QFN, 80-Leads, Body 10.0x10.0mm, Height = 0.85mm, Pitch 0.40mm, Thermal Pad 3.4x3.4mm

RP2354A

Package QFN-60 for RP2354A. QFN, 60-Leads, Body 7.0x7.0mm, Height = 0.85mm, Pitch 0.40mm, Thermal Pad 3.4x3.4mm